Polytetrafluoroethylene porous film and process for preparing the same

ABSTRACT

A polytetrafluoroethylene (PTFE) porous film is formed from a PTFE resin molding powder obtained by suspension polymerization. The film has a porosity of 40 to 80% and a removal ratio of uniform particles having a diameter of 0.2 μm less than 99%, or has a porosity of 40 to 80% and a bubble point of not less than 3 kg/cm 2 . This PTFE porous film is obtained by a process of compression-molding a PTFE resin molding powder to prepare a preform, sintering the preform at a temperature not lower than the melting point of the unsintered PTFE, processing the preform into films, then laminating at least two of the obtained films, fusing the films to unite them, and subjecting the obtained film to uniaxial or biaxial stretching at a temperature not higher than a melting point of the sintered PTFE. If desired, the finally obtained film may be subjected to heat setting. In the PTFE porous film of the invention, pores are nearly round and the diameters of the pores are almost uniform. Further, the porous film of the invention has a high porosity and is excellent in mechanical strength, so that the film is free from the pinholes even when the thickness of the film is small. The PTFE porous film can be efficiently prepared by sequential biaxial stretching or the like, without breakage.

This is a continuation-in-part application of Ser. No. 07/907,849, filedJul. 2, 1992, now abandoned.

FIELD OF THE INVENTION

The present invention relates to a polytetrafluoroethylene (PTFE) porousfilm and processes for preparing the same. More particularly, theinvention relates to a PTFE porous film which is formed from a moldingpowder of PTFE obtained by suspension polymerization and which hasnearly round and relatively uniform pores and are excellent in waterpermeability, porosity, mechanical strength and productivity, and alsorelates to processes for preparing the PTFE porous film.

BACKGROUND OF THE INVENTION

Polytetrafluoroethylene resins are employed in various fields because oftheir excellent chemical resistance, heat resistance and mechanicalproperties. For example, porous films made of the PTFE resins are widelyemployed as filters for corrosive substances or high temperaturesubstances utilizing the above-mentioned excellent properties, and alsoemployed as electrolytic membranes, fuel batteries or medical tubingsuch as artificial blood vessels and artificial tracheas.

Recently, porous films having pores of nearly round and uniformdiameters are demanded in accordance with developments in thesemiconductor art or the molecular biology art, because extremely smallsized impurities can be removed by the use of those films. As suchporous films, PTFE porous films have been the subject of increasinginterest.

In a conventional process for preparing porous films of the PTFE resins,extremely small sized particles of PTFE (called fine powder) having amean primary particle diameter of 0.1 to 0.4 μm obtained byemulsification polymerization of tetrafluoroethylene are used, and thisprocess comprises the steps of adding a liquid lubricant to the finepowder, compression-preforming the mixture, subjecting the obtainedpreform to extrusion and/or calendering to give a film, removing theliquid lubricant from the film to obtain a PTFE film, and thensubjecting the PTFE film to uniaxial or biaxial stretching underheating. For example, Japanese Patent Publication No. 53(1988)-42794describes a process for preparing a PTFE porous film characterized byheating a sintered PTFE resin film to a temperature not lower than 327°C. then slowly cooling the film, heat-treating the film so that itscrystallinity becomes not less than 80%, and then uniaxially stretchingthe film within the temperature range of 25° to 260° C. in a draw ratioof 1.5 to 4 times.

In the above process, however, it is difficult to prepare a PTFE porousfilm having nearly round pores and desired pore sizes. Further, the PTFEfilm used as a raw film in this process sometimes has pinholes, voids orscratches, and hence the obtained porous film is not always sufficientin mechanical strength.

For solving the above-mentioned problem, there has been proposed aprocess for preparing a polytetrafluoroethylene porous film whichcomprising the steps of compression-molding a PTFE resin powder having amean particle diameter of 1 to 900 μm obtained by a suspensionpolymerization to prepare a PTFE preform, sintering the preform at atemperature not lower than 327° C. processing the preform into a film,then sintering the obtained film at a temperature not lower than 327° C.then quenching the film at a cooling rate of 70° C./hr or more todecrease crystallinity of the film to not more than 55%, and uniaxiallyor biaxially stretching the film in a draw ratio of 1.3 to 6.5 timesunder heating at a temperature of 100° to 320° C.

However, the PTFE porous film prepared by this process is low both inwater permeability and porosity. If the thickness of the film is madesmaller to increase water permeability, the film is liable to be brokenoff during the stretching treatment. Further, even if the stretchingtreatment is possible, the resulting porous film sometimes suffersvisible pinholes having a hole diameter of not less than 0.1 mm. In thisprocess, moreover, sequential stretching can hardly be accomplished madebecause the porous film is liable to be broken during the stretchingtreatment, and therefore only single part production (sheet formproduction) using a simultaneous biaxial stretching is possible. Hence,it is difficult to prepare porous films with high productivity.

OBJECT OF THE INVENTION

The present invention intends to solve the above-mentioned problemsassociated with the prior art, and an object of the invention is toprovide a PTFE porous film with nearly round pores which is excellent inwater-permeability, porosity and mechanical strength and free frompinholes so as not to be broken even if the thickness is small, andmoreover which can be uniformly prepared with high production efficiencyand high stability. Another object of the invention is to provideprocesses for preparing the PTFE porous films.

SUMMARY OF THE INVENTION

The polytetrafluoroethylene porous film of the invention is apolytetrafluoroethylene porous film which is formed from apolytetrafluoroethylene resin molding powder obtained by a suspensionpolymerization and has a porosity of 40 to 80%, and a removal ratio ofuniform particles having 0.2 μm diameter of not less than 99%, or has aporosity of 40 to 80% and a bubble point of not less than 3 kg/cm².

This polytetrafluoroethylene porous film preferably has a thickness of10 to 500 μm, and the porous film is preferably obtained from a unitedproduct obtained by laminating two or more polytetrafluoroethylene filmsone upon another and fusing them.

A first process for preparing a polytetrafluoroethylene porous filmaccording to the invention is a process comprising the steps ofcompression-molding a polytetrafluoroethylene resin molding powderobtained by a suspension polymerization to prepare apolytetrafluoroethylene preform, sintering the preform at a temperaturenot lower than the melting point of the unsinteredpolytetrafluoroethylene, processing the sintered preform into films,then superposing two or more of the obtained films one upon another andfusing them at a temperature not lower than the melting point of thesintered polytetrafluoroethylene resin to unite them, followed bycooling, and then subjecting the fused and united film to uniaxial orbiaxial stretching at a temperature not higher than a melting point ofthe polytetrafluoroethylene resin.

A second process for preparing a polytetrafluoroethylene porous filmaccording to the invention is a process comprising the steps ofcompression-molding the sintered polytetrafluoroethylene resin moldingpowder obtained by a suspension polymerization to prepare apolytetrafluoroethylene preform, sintering the preform at a temperaturenot lower than the melting point of the unsinteredpolytetrafluoroethylene, processing the sintered preform into films,then superposing two or more of the obtained films one upon another andfusing them at a temperature not lower than the melting point of thesintered polytetrafluoroethylene resin to unite them, followed bycooling, then subjecting the fused and united film to uniaxial orbiaxial stretching at a temperature not higher than the melting point ofthe sintered polytetrafluoroethylene resin, and subjected the film toheat setting.

A third process for preparing a polytetrafluoroethylene porous filmaccording to the invention is a process comprising the steps ofcompression-molding a polytetrafluoroethylene resin molding powderobtained by a suspension polymerization to prepare apolytetrafluoroethylene preform, sintering the preform at a temperaturenot lower than the melting point of the unsinteredpolytetrafluoroethylene, processing the sintered preform into films,then heating at least two of the obtained polytetrafluoroethylene filmsat a temperature lower than the melting point of the sinteredpolytetrafluoroethylene to contact bond them, further heating thepolytetrafluoroethylene film bonded product at a temperature not lowerthan the melting point of the sintered polytetrafluoroethylene to fuseand unite it, and subjecting the fused and united film to uniaxial orbiaxial stretching at a temperature not higher than the melting point ofthe sintered polytetrafluoroethylene resin.

A fourth process for preparing a polytetrafluoroethylene porous filmaccording to the invention is a process comprising the steps ofcompression-molding a polytetrafluoroethylene resin molding powderobtained by a suspension polymerization to prepare apolytetrafluoroethylene preform, sintering the preform at a temperaturenot lower than the melting point of the unsinteredpolytetrafluoroethylene, processing the sintered preform into films,then heating at least two of the obtained polytetrafluoroethylene filmsat a temperature lower than a melting point of the sinteredpolytetrafluoroethylene to be contact bond them, further heating thepolytetrafluoroethylene film bonded product at a temperature not lowerthan melting point of the sintered polytetrafluoroethylene to fuse andunite it, subjecting the fused and united film to uniaxial or biaxialstretching at a temperature not higher than the melting point of thesintered polytetrafluoroethylene resin, and subjecting the film to heatsetting.

BRIEF DESCRIPTION OF THE DRAWING

FIG. 1 is a schematic sectional view showing steps of the process forpreparing a PTFE porous film in one embodiment of the invention.

FIG. 2 is a view showing steps of the process for preparing a PTFEporous film in another embodiment of the invention.

DETAILED DESCRIPTION OF THE INVENTION

The polytetrafluoroethylene (PTFE) porous film of the invention and theprocesses for preparing the porous film are described in detailhereinafter.

The PTFE porous film of the invention is prepared from apolytetrafluoroethylene resin molding powder (PTFE molding powder)obtained by a suspension polymerization.

In the PTFE porous film prepared from the PTFE molding powder, it ispossible to make pores which are nearly round and to make the diametersof the pores uniform and fixed ones.

The PTFE porous film of the invention has a porosity (pore volume) of 40to 80%, preferably 45 to 70%, particularly 45 to 60%. In thisspecification, the porosity of the PTFE porous film is determined in thefollowing manner.

Measurement of porosity

Thickness and weight of a circular standard sample of flat membrane (26mm diameter) are measured. The porosity Pv (pore volume) is determinedby the following formula: ##EQU1##

wherein ρ is density, V is volume of membrance, and w is weight.

Further, the PTFE porous film of the invention has a removal ratio ofuniform particle having 0.2 μm diameter of not less than 99%. Otherwise,the PTFE porous film of the invention has a bubble point of not lessthan 3 kg/cm², preferably not less than 4 kg/cm².

In the present specification, the removal ratio of uniform particle andthe bubble point are determined in the following manners.

Measurement of the removal ratio of uniform particle

To the circular membrane (26 mm diameter) is passed through ultra-purewater dispersion containing uniform particles of commercially availablepolystyrene latex, e.g. produced by Magsfear Co., Ltd., in an amount of1.4×10¹³ particles/ml. The passed medium is introduced into a cell, andthe absorbance thereof is measured at the wavelength of 400 nm. Theremoval ratio of uniform particle is determined by the followingformula: ##EQU2##

The minimum particle diameter of which the removal ratio of uniformparticle becomes 100% is considered to be the pore size of the porousfilm. That is, when uniform particles of polystyrene latex having 0.069μm diameter are perfectly removed (100%), the pore size of the porousfilm is considered as 0.069 μm.

Measurement of the bubble point

The bubble point was measured in accordance with ASTM-F-316.

The bubble point method is known as a way for determinating the greatestpore size in the porous film. The bubble point indicates the minimumpressure at which gas flows off the fluid membrane immersed in a smallpore, and becomes an index of pore size in the porous film

Furthermore, it is desired that the PTFE porous film. of the inventionhas a water permeability Q of 200 to 4,000 liter/hr·m² ·atm, preferably800 to 2000 liter/hr·m² ·atm. In this specification, the waterpermeability Q can be determined in the following manner.

Measurement of the water permeability Q

The porous film is immersed in 100% ethanol to be hydrophilic.Successively, ultra-pure water is passed through the porous film toreplace ethanol with ultra-pure water. The flow rate of filteredultra-pure water is measured at 23° C. under a differential pressure of4 kg/cm².

The water permeability Q is determined by the following formula:##EQU3##

wherein S is membrane surface area, T is filtration time, P isdifferential pressure at filtration, and V is an amount of filteredwater (ml).

It is also desired that the PTFE porous film has a thickness of 10 to500 μm, preferably 15 to 100 μm. Moreover, this PTFE porous film ispreferably obtained from a united product obtained by laminating two ormore PTFE films one upon another and fusing them.

In the case of forming the PTFE porous film from a united productobtained by laminating two or more PTFE films one upon another andfusing them, even if one of the PTFE films has pinholes, voids orscratches, those pinholes, voids or scratches can be recovered bylaminating the film on other film PTFE and fusing them together. As aresult, a PTFE porous film improved in the mechanical strength andsufficiently controlled in the pore diameters can be obtained.

As described above, the PTFE porous film of the invention has a greatnumber of extremely small sized pores with uniform pore diameters, sothat it is excellent in the porosity. Further, the crystallinity of theporous film can be lower than 65%.

Next, the processes for preparing the PTFE porous film according to theinvention are described below.

A starting material used in the processes for preparing the PTFE porousfilm according to the invention is a polytetrafluoroethylene powderobtained by a suspension polymerization of tetrafluoroethylene, whereinthe polytetrafluoroethylene powder has a mean particle diameter ofpreferably 1 to 900 μm, more preferably 1 to 50 μm.

The PTFE porous film can be prepared from the above-mentioned PTFE resinpowder by a process of the following steps.

In the first place, the polytetrafluoroethylene powder (PTFE moldingpowder) obtained by a suspension polymerization is compression-molded toprepare a preform, and the preform is sintered at a temperature notlower than the melting point to prepare a of the unsinteredpolytetrafluoroethylene polytetrafluoroethylene molded product. In moredetail, the PTFE preform mentioned. as above can be obtained by moldinga polytetrafluoroethylene powder (i.e., molding powder) prepared by asuspension polymerization of tetrafluoroethylene in a mold or the likeunder a molding pressure of 100 to 350 kg/cm². Then, the preform issintered at a temperature not lower than the melting point of theunsintered polytetrafluoroethylene powder, preferably a temperature of350° to 380° C. and then slowly cooled to obtain a PTFE molded product.The melting point of the unsintered polytetrafluoroethylene can bedetermined by analyzing the polytetrafluoroethylene powder obtained by asuspension polymerization using a differential scanning calorimeter(DSC) and taking the peak value on the DSC chart as the melting point ofthe unsintered polytetrafluoroethylene.

The PTFE molded product is usually in the shape of a block (in the shapeof cylinder), but it may be molded into other shapes such as the shapeof a film, rod or sheet depending on the use or application. Forexample, for preparing a film from the block-shaped PTFE molded product,the block-shaped molded product is cut into a film having a thickness ofabout 0.01 to 2 mm, preferably about 0.02 to 0.2 mm, using a filmcutting machine, etc. There is no specific limitation on the thicknessof the filmy PTFE molded product obtained as above. The filmy PTFEmolded product is also referred to a "raw film" hereinafter.

In the above, the PTFE film (i.e., filmy PTFE molded product) isobtained by sintering the PTFE preform and then cutting it, but a PTFEfilm obtained by methods the than the cutting method can be alsoemployed in the invention. In other Words, any PTFE films can beemployed in the invention, with the proviso that they are PTFE filmsobtained by compression-molding a PTFE molding powder having a meanparticle diameter of 1 to 900 μm obtained by a suspension polymerizationand then sintering the resulting preform.

In the first process according to the invention, at least two of thefilmy PTFE molded products obtained as above are superposed one uponanother, as shown in FIG. 1, and they are fused at a temperature notlower than the melting point of the sintered polytetrafluoroethyleneresin, preferably a temperature of 340° to 400° C., so as to be united,and then cooled. The melting point of the sinteredpolytetrafluoroethylene resin is determined by analyzing theabove-prepared sintered polytetrafluoroethylene by means of DSC andtaking the peak value on the DSC chart as the melting point of thesintered polyetrafluoroethylene. The number of the PTFE films usedherein is two or more, preferably in the range of 2 to 10, morepreferably in the range of 2 to 4.

The heating means used in the above process is, for example, a metalplate press 2 shown in FIG. 1. Between the PTFE film and the metal platepress, an aluminum foil 3 or the like may be interposed. Cooling of thefused PTFE film may be either a slow cooling or a rapid cooling. Thefilmy PTFE molded products are heated to a temperature not lower thanthe melting point of the sintered polytetrafluoroethylene and fused soas to be united as described above, whereby both films compensate eachother for interparticle defects existing within the film and scratcheson the surface of the film given by the cutting procedure, such defectsand scratches causing breakage of the film during the stretchingtreatment. As a result, occurrence of breakage in the stretchingtreatment can be prevented. For fusing and uniting the filmy PTFE moldedproducts, any method can be employed with the proviso that two or moreof the films can be fused and united. In the present invention, asdescribed above, a cause of breakage during the stretching treatment isremoved by fusing and uniting two or more of the films.

Examples of the methods for fusing and uniting the films include theabove-mentioned method of using the metal plate press; a method of usinga roll press; a method of winding the films around a cylinder, andfusing and uniting the films on the cylinder utilizing expansion of thecylinder; a method of winding the films around a cylinder, furtherwinding a heat-shrinkable film therearound by interposing an aluminumfoil or the like and fusing the films on the cylinder utilizing tensiongiven by the heat shrinkage; and other methods. However, in the casewhere the films have a free surface (surface exposed to air) and thefusing procedure takes a long period of time (e.g., more than 20 minutesat 350° C.), particulate protuberances might be produced on the freesurface of the film and those protuberances cause a decrease of waterpermeability. Therefore, the fusing procedure is preferably carried outunder the condition that the films to be fused do not have such a freesurface. In other words, all over the surface of the raw film, laminateis preferably in contact with a pressure means such as a metal platepress. The pressure in the fusing procedure in the invention isgenerally within the range of 0.01 to 10 kg/cm², preferably 0.03 to 10kg/cm², more preferably not higher than 1 kg/cm².

Through the above-mentioned treatment, pores of the finally obtainedPTFE porous film can be controlled to have fixed sizes and can be madenearly round. Further, this treatment can increase the porosity of thefinally obtained PTFE porous film and also increase the mechanicalstrength thereof. The fused and united PTFE film obtained by the abovetreatment is free from occurrence of breakage or pinholes in thesubsequent stretching treatment.

The fused and united PTFE film prepared as above is then uniaxially orbiaxially stretched at a temperature not higher than the melting pointof the sintered polytetrafluoroethylene, preferably 19° to 320° C., morepreferably 50° to 290° C. in the uniaxial direction in a draw ratio of1.3 to 6.5 times, or in the biaxial directions each in a draw ratio of1.3 to 6.5 times, preferably in the uniaxial direction in a draw ratioof 1.8 to 3.0 times, or in the biaxial directions each in a draw ratioof 1.8 to 3.0 times. In the case of utilizing a biaxial stretching, thefilm may be subjected to so-called "sequential biaxial stretching", thatis, the film is first uniaxially stretched in the machine direction andthen uniaxially stretched in the transverse direction. In this case, thestretching in the transverse direction can be made prior to thestretching in the machine direction. Further, a simultaneous biaxialstretching can be also adopted. The stretching speed of the film ispreferably not less than 15 mm/sec when a film having a 200 mm length inthe machine direction is used. In other words, the draw ratio ispreferably larger than 450 %/min.

By subjecting the fused and united PTFE film to the biaxial stretching,the shapes of the pores in the resulting PTFE porous film are almostperfectly round. If the stretching temperature of PTFE is lower than 19°C., a breakage or other defect is observed in the resulting PTFE porousfilm and the PTFE porous film is insufficient in mechanical strength, sothat such temperature is unfavorable, On the other hand, if thetemperature of PTFE is higher than 320° C. pores of uniform diameterscannot not be produced in the resulting PTFE porous film, so that suchtemperature is unfavorable.

In the second process according to the invention, the PTFE porous filmobtained by the above-mentioned first process is further subjected toheat setting. This heat setting is carried out at a temperature notlower than 150° C. preferably in the range of not lower than 150° C. butlower than the Melting point of PTFE porous film, more preferably in therange of 200° to 300° C., while keeping the fixed temperature. This heatsetting is particularly preferred especially when the fused and unitedPTFE film is stretched at a low temperature, for example, a temperaturelower than 140° C. to prepare a PTFE porous film.

By carrying out such heat setting after the stretching of the PTFE film,a PTFE porous film much more improved in the stability of pore sizes canbe obtained. Further, owing to the heat setting, the water permeabilityand the porosity of the resulting PTFE porous film can be enhanced, andthe heat shrinkage thereof can be reduced.

The heat setting is preferably carried out by fixing the peripheralportion of the PTFE porous film with a chuck (supporting tool),stretching the PTFE porous film in a draw ratio slightly higher than thepredetermined draw ratio, and then returning the draw ratio to thepredetermined draw ratio.

In the third process according to the invention, the aforementioned PTFEresin molding powder obtained by a suspension polymerization iscompression-molded to prepare a PTFE preform; the preform is sintered ata temperature not lower than the melting point of the unsintered PTFE;then the preform is processed to give raw films; and two or more of theraw films are contact bonded under heating at a temperature of nothigher than the melting point of the sintered polytetrafluoroethylene soas to be united.

For example, as shown in FIG. 2, two of the raw films 1a, 1b having athickness of about 0.01 to 2.0 mm, preferably about 0.02 to 0.2 mm, aresuperposed one upon another by way of tension controls 4a, 4b, and theraw films are heated at a temperature not higher than the melting pointof the sintered polytetrafluoroethylene, preferably 100° to 300° C.,more preferably 140° to 250° C., so as to be bonded.

The number of the raw films to be contact bonded under heating is atleast two, preferably 2 to 10, more preferably 2 to 4. For heating atleast two of the raw films to a temperature not higher than the meltingpoint, rolls 5, 6, 7 are heated to make a preheating zone.

The bonding of at least two of the raw films can be carried out, forexample, by passing at least two of the raw films through a pair ofpressure rolls 8a, 8b. In this case, it is desired that at least two ofthe raw films are rolled and bonded in such a manner that T₂ /T₁ is 0.3to 0.9, preferably 0.5 to 0.9, wherein T₁ (mm) is a total thickness ofall of the raw films and T₂ (mm) is a thickness of the resulting PTFEbonded film (PTFE film bonded product) obtained by bonding the filmsthrough the pressure rolls.

By contact bonding at least two of the PTFE films as described above, noair is present between the PTFE films, and thereby a PTFE film bondedproduct having a uniform thickness can be obtained.

The PTFE film bonded product prepared as above is then desirably cooledby means of, for example, a water-cooling roll 9.

Subsequently, the PTFE film bonded product is heated to a temperaturenot lower than the melting point of PTFE the sintered preferably notlower than 327° C., more preferably in the range of 340° to 400° C. byfor example passing the product through a heating zone 10, so as to fuseand unite the bonded films. The heating time varies depending on theheating temperature, but generally is in the range of 10 seconds to 30minutes or thereabouts.

During the above-mentioned procedure of fusing the PTFE film bondedproduct, a tension may be applied to the PTFE film bonded product bymeans of a tension controller or the like.

In the invention, at least two of the raw films are heated at atemperature lower than the melting point of the sinteredpolytetrafluoroethylene so as to be bonded and then the resulting PTFEbonded films are heated at a temperature not lower than a melting pointof the sintered polytetrafluoroethylene so as to be united, as describedabove. Accordingly, even if one of the PTFE films has scratches,pinholes or voids, other PTFE film(s) recover the defects, and theunited PTFE film is free from such scratches, pinholes or voids. As aresult, the PTFE film can be prevented from occurrence of breakage inthe subsequent stretching treatment.

The fused and united PTFE film prepared as above is then subjected touniaxial or biaxial stretching at a temperature not higher than amelting point of the PTFE the sintered resin in the same manner as thatof the aforementioned first or second process. The stretching conditionsare the same as those mentioned before.

By subjecting the PTFE film to the biaxial stretching, the shapes of thepores in the resulting PTFE porous film are almost perfectly round.Further, since the stretching is carried out within the aforementionedtemperature range, the obtained PTFE porous film is excellent inmechanical strength and has pores of uniform diameters.

In the fourth process according to the invention, the PTFE porous filmobtained by the above-mentioned third process is further subjected toheat setting. The conditions for this heat setting are the same as thoseof the aforementioned second process.

EFFECT OF THE INVENTION

The PTFE porous film of the invention has nearly round pores withuniform pore diameters, and shows a high porosity and a high mechanicalstrength, so that the PTFE porous film is free from occurrence ofpinholes even when the thickness thereof is made small. Further,according to the processes of the invention for preparing a PTFE porousfilm, a PTFE porous film having the above-mentioned excellent propertiescan be prepared with high efficiency utilizing a sequential biaxialstretching or the like, and the obtained PTFE porous film is free fromoccurrence of breakage.

The present invention is further illustrated by the following examplesand comparative examples, but these examples by no means restrict theinvention.

EXAMPLE 1

A PTFE molding powder (Polyflon M-12, available from Daikin Kogyo K.K.)having a mean particle diameter of 20 μm obtained by a suspensionpolymerization was molded in a mold at a molding pressure of 150 kg/cm²and then sintered at 365° C., to obtain a PTFE molded product in theshape of block.

The obtained block-shaped molded product was skived to give a filmy PTFEmolded product (1) having a thickness of 30 μm. Then, two of theobtained filmy PTFE molded products (1) were superposed one uponanother, and they were heated at a temperature of 350° C. under apressure of 0.5 kg/cm² for 30 minutes to fuse and unite them, followedby cooling at a cooling rate of 5° C./min, to prepare a PTFE moldedproduct (2) (200 mm×200 mm). The PTFE molded product (2) was thenstretched in the biaxial directions simultaneously each in a draw ratioof 1.8 times.

The obtained PTFE porous film had a thickness of 30 μm and a size of 360mm×360 mm. The number of pinholes in the porous film was 0 per 1 cm².

COMPARATIVE EXAMPLE 1

The procedure of Example 1 was repeated except for stretching the filmyPTFE molded product (1) of 30 μm in thickness obtained by skiving theblock-shaped preform, without superposing and fusing two of them, toprepare a PTFE porous film.

The number of pinholes in the obtained porous film was 1.02 per 1 cm².

EXAMPLE 2

Two of the PTFE molded products (1) obtained in Example 1 weresuperposed one upon another, and they were wound around a cylinder.Further, a PTFE heat-shrinkable tape was wound therearound byinterposing an aluminum foil, and they were heated altogether at 370° C.for 2 hours to fuse and unite the PTFE molded products (1) by thetension provided by the heat shrinkage of the heat-shrinkable tape.Then, the fused and united PTFE molded product was cooled to prepare aPTFE molded product (2'). The cooling rate in the cooling procedure was5° C./hr. The PTFE molded product (2') was then stretched at 270° C. inthe biaxial directions simultaneously each in a draw ratio of 1.8 times.The obtained porous film had a thickness of 33 μm, a water permeabilityQ of 915 liter/hr·m² ·atm and a porosity of 51%. This porous film showedhigh values both in water permeability and porosity.

EXAMPLE 3

The PTFE molded product (2) obtained in Example 1 was stretched at 290°C. in the biaxial directions sequentially each in a draw ratio of 1.8times. The obtained PTFE porous film had a thickness of 30 μm, a waterpermeability Q of 374 liter/hr·m² ·atm and a porosity of 47%. Further,the porous film had a tensile strength at break of 280 kgf/cm² in themachine direction (M.D.) and that of 250 kgf/cm² in the transversedirection (T.D.).

COMPARATIVE EXAMPLE 2

The filmy PTFE molded product (1) obtained in Example 1 was subjected tosequential stretching in the same manner as described in Example 3without superposing and fusing two of the molded products (1), but thePTFE molded product (1) was broken off.

If the thickness of the filmy PTFE molded product (1) is not less than0.1 mm, the sequential stretching is possible.

EXAMPLE 4

The PTFE molded product (2) obtained in Example 1 was stretched at 160°C. in the biaxial directions sequentially each in a draw ratio of 2.1times (stretching speed: 50 mm/sec). The obtained PTFE porous film had athickness of 31 μm, a water permeability Q of 719 liter/hr·m² ·atm and aporosity of 48%.

EXAMPLE 5

The PTFE molded product (2) obtained in Example 1 was stretched at 127°C. in the biaxial directions sequentially each in a draw ratio of 2.1times (stretching speed: 40 mm/sec). The obtained PTFE porous film had athickness of 34 μm, a water permeability Q of 719 liter/hr·m² ·atm and aporosity of 50%.

EXAMPLE 6

The PTFE molded product (2) obtained in Example 1 was stretched at 76°C. in the biaxial directions sequentially each in a draw ratio of 2.2times (stretching speed: 50 mm/sec). The obtained PTFE porous film had athickness of 34 μm, a water permeability Q of 621 liter/hr·m² ·atm and aporosity of 53%.

EXAMPLE 7

The PTFE molded product (2) obtained in Example 1 was stretched at 64°C. in the biaxial directions sequentially each in a draw ratio of 2.19times (stretching speed: 20 mm/sec). The obtained PTFE porous film had athickness of 34 μm, a water permeability Q of 716 liter/hr·m² ·atm and aporosity of 52%.

EXAMPLE 8

The PTFE molded product (2) obtained in Example 1 was stretched at 122°C. in the biaxial directions sequentially each in a draw ratio of 2times (stretching speed: 30 mm/sec). The obtained PTFE porous film had athickness of 35 μm, a water permeability Q of 580 liter/hr·m² ·atm and aporosity of 47%.

EXAMPLE 9

The PTFE molded product (2) obtained in Example 1 was stretched at 118°C. in the biaxial directions sequentially each in a draw ratio of 2.1times (stretching speed: 60 mm/sec). The obtained PTFE porous film had athickness of 36 μm, a water permeability Q of 653 liter/hr·m² ·atm and aporosity of 51%.

EXAMPLE 10

The PTFE molded product (2) obtained in Example 1 was stretched at 66°C. in the biaxial directions sequentially each in a draw ratio of 2.2times (stretching speed: 70 mm/sec). The obtained PTFE porous film had athickness of 35 μm, a water permeability Q of 550 liter/hr·m² ·atm and aporosity of 51%.

EXAMPLE 11

The PTFE molded product (2) obtained in Example 1 was stretched at 68°C. in the biaxial directions sequentially each in a draw ratio of 2.75times (stretching speed: 50 mm/sec). Then, the draw ratio was returnedto 2.1 times and the resulting product was subjected to heat setting at170° C. for 5 minutes. The obtained PTFE porous film had a thickness of36 μm, a water permeability Q of 720 liter/hr·m² ·atm and a porosity of53%.

EXAMPLE

The PTFE molded product (2) obtained in Example 1 was stretched at 75°C. in the biaxial directions sequentially each in a draw ratio of 2.75times (stretching speed: 50 mm/sec). Then, the draw ratio was returnedto 2.1 times and the resulting product was subjected to heat setting at200° C. for 5 minutes. The obtained PTFE porous film had a thickness of36 μm, a water permeability Q of 779 liter/hr·m² ·atm and a porosity of52%.

EXAMPLE

The PTFE molded product (2) obtained in Example 1 was stretched at 73°C. in the biaxial directions sequentially each in a draw ratio of 2.75times (stretching speed: 50 mm/sec). Then, the draw ratio was returnedto 2.1 times and the resulting product was subjected to heat setting at250° C. for 5 minutes. The obtained PTFE porous film had a thickness of37 μm, a water permeability Q of 981 liter/hr·m2·atm and a porosity of53%.

EXAMPLE 14

The PTFE molded product (2) obtained in Example 1 was stretched at 77°C. in the biaxial directions sequentially each in a draw ratio of 2.81times (stretching speed: 50 mm/sec). Then, the draw ratio was returnedto 2.15 times and the resulting product was subjected to heat setting at200° C. for 5 minutes. The obtained PTFE porous film had a thickness of35 μm, a water permeability Q of 1,024 liter/hr·m² ·atm and a porosityof 54%.

EXAMPLE 15

A PTFE molding powder (Polyflon M-12, available from Daikin Kogyo K.K.)having a mean particle diameter of 20 μm obtained by a suspensionpolymerization was molded in a mold at a molding pressure of 175 kg/cm²and then sintered at 365° C., to obtain a PTFE molded product in theshape of block.

The obtained block-shaped molded product was skived to give a filmy PTFEmolded product (3) having a thickness of 30 μm. Then, two of the filmyPTFE molded products (3) were superposed one upon another and they werebonded under heating at a temperature of 160° C. to obtain apolytetrafluoroethylene film bonded product having a thickness of 37 μm.The obtained polytetrafluoroethylene film bonded product was heated at350° C. for 1 hour, subsequently quenched to obtain a fused and unitedPTFE molded product (4). The thickness of the PTFE molded product (4)was 61.1 μm. The cooling rate in the cooling procedure was 15° C./min.

The PTFE molded product (4) obtained as above was stretched at 50° C. inthe biaxial directions sequentially each in a draw ratio of 2.1 times(stretching speed: 50 mm/sec). The obtained PTFE porous film had athickness of 37 μm, a water permeability Q of 380 liter/hr·m² ·atm, aporosity of 49%, and a removal ratio of uniform particles having 0.038μm diameter of 100%. Further, the number of pinholes in this PTFE porousfilm was 0 per 1 cm².

COMPARATIVE EXAMPLE 3

The procedure of Example 15 was repeated except for stretching the filmyPTFE molded product (3) of 30 μm in thickness obtained by skiving theblock-shaped molded product without superposing and fusing two of them,to prepare a PTFE porous film.

The number of pinholes in the obtained PTFE porous film was 1.02 per 1cm².

EXAMPLE 16

The PTFE molded product (4) obtained in Example 15 was stretched at 72°C. in the biaxial directions sequentially each in a draw ratio of 2.13times (stretching speed: 50 mm/sec). The obtained PTFE porous film had athickness of 36 μm, a water permeability Q of 460 liter/hr·m² ·atm and aporosity of 52%.

EXAMPLE 17

The PTFE molded product (4) obtained in Example 15 was stretched at 290°C. in the biaxial directions sequentially each in a draw ratio of 1.8times. The obtained PTFE porous film had a thickness of 30 μm, a waterpermeability Q of 374 liter/hr·m² ·atm and a porosity of 47%. Further,the porous film had a tensile strength at break of 280 kgf/cm² in themachine direction (M.D.), that of 250 kgf/cm² in the transversedirection (T.D.), a removal ratio of uniform particles having 0.038 μmdiameter of 95%, and bubble point value of 4.2 kg/cm².

COMPARATIVE EXAMPLE 4

The filmy PTFE molded product (3) having 30 μm thickness obtained inExample 15 was subjected to sequential stretching in the same manner asdescribed in Example 16 without laminating and fusing two of them, butthe filmy PTFE molded product (3) was broken off.

If the thickness of the filmy PTFE molded product (3) is not less than0.1 mm, sequential stretching is possible.

EXAMPLE 18

The PTFE molded product (4) obtained in Example 15 was stretched at 160°C. in the biaxial directions sequentially each in a draw ratio of 2.1times (stretching speed: 50 mm/sec). The obtained PTFE porous film had athickness of 31 μm, a water permeability Q of 719 liter/hr·m² ·atm, aporosity of 48%, a removal ratio of uniform particles having 0.038 μmdiameter of 89%, and a removal ratio of 100% for particles having a0.069 μm diameter.

EXAMPLE 19

The PTFE molded product (4) obtained in Example 15 was stretched at 127°C. in the biaxial directions sequentially each in a draw ratio of 2.1times (stretching speed: 40 mm/sec). The obtained PTFE porous film had athickness of 34 μm, a water permeability Q of 719 liter/hr·m² ·atm, aporosity of 50%, a removal ratio of uniform particles having 0.038 μmdiameter of 97%, and a removal ratio of 100% for particles having a0.069 μm diameter.

EXAMPLE 20

The PTFE molded product (4) obtained in Example 15 was stretched at 76°C. in the biaxial directions sequentially each in a draw ratio of 2.2times (stretching speed: 50 mm/sec). The obtained PTFE porous film had athickness of 34 μm, a water permeability Q of 621 liter/hr·m2·atm, aporosity of 53%, a removal ratio of uniform particles having 0.038 μmdiameter of 99%, and a removal ratio of 100% for particles having a0.069 μm diameter.

EXAMPLE 21

The PTFE molded product (4) obtained in Example 15 was stretched at 72°C. in the biaxial directions sequentially each in a draw ratio of 2.75times (stretching speed: 50 mm/sec). Then, the draw ratio was returnedto 2.1 times and the resulting product was subjected to heat setting at170° C. for 5 minutes. The obtained PTFE porous film had a thickness of36 μm, a water permeability Q of 819 liter/hr·m² ·atm, a porosity of55%, a removal ratio of uniform particles having 0.038 μm diameter of85%, and a removal ratio of 100% for particles having a 0.069 μmdiameter.

EXAMPLE 22

The PTFE molded product (4) obtained in Example 15 was stretched at 77°C. in the biaxial directions sequentially each in a draw ratio of 2.75times (stretching speed: 50 mm/sec). Then, the draw ratio was returnedto 2.1 times and the resulting product was subjected to heat setting at200° C. for 5 minutes. The obtained PTFE porous film had a thickness of36 μm, a water permeability Q of 998 liter/hr·m² ·atm, a porosity of55%, a removal ratio of uniform particles having 0.038 μm diameter of76%, and a removal ratio of 100% for particles having a 0.069 μmdiameter.

EXAMPLE 23

The PTFE molded product (4) obtained in Example 15 was stretched at 74°C. in the biaxial directions sequentially each in a draw ratio of 2.75times (stretching speed: 50 mm/sec). Then, the draw ratio was returnedto 2.1 times and the resulting product was subjected to heat setting at250° C. for 5 minutes. The obtained PTFE porous film had a thickness of36 μm, a water permeability Q of 964 liter/hr·m² ·atm, a porosity of55%, a removal ratio of uniform particles having 0.038 μm diameter of95%, and a removal ratio of 100% for particles having a 0.069 μdiameter.

What is claimed is:
 1. A process for preparing a polytetrafluoroethyleneporous film comprising the steps of compression-molding apolytetrafluoroethylene resin molding powder obtained by a suspensionpolymerization to prepare a polytetrafluoroethylene preform, sinteringthe preform at a temperature not lower than the melting point of theunsintered polytetrafluoroethylene, processing the sintered preform intofilms, then superposing at least two of the films one upon another andfusing them at a temperature not lower than the melting point of thesintered polytetrafluoroethylene resin to unite them, followed bycooling, and then subjecting the fused and united film to uniaxial orbiaxial stretching at a temperature not higher than the melting point ofthe sintered polytetrafluoroethylene resin.
 2. A process for preparing apolytetrafluoroethylene porous film comprising the steps ofcompression-molding a polytetrafluoroethylene resin molding powderobtained by a suspension polymerization to prepare apolytetrafluoroethylene preform, sintering the preform at a temperaturenot lower than the melting point of the unsinteredpolytetrafluoroethylene, processing the sintered preform into films,then superposing at least two of the films one upon another and fusingthem at a temperature not lower than the melting point of the sinteredpolytetrafluoroethylene resin to unite them, followed by cooling, thensubjecting the fused and united film to uniaxial or biaxial stretchingat a temperature not higher than the melting point of the sinteredpolytetrafluoroethylene resin, and subjecting the film to heat setting.3. A process for preparing a polytetrafluoroethylene porous filmcomprising the steps of compression-molding a polytetrafluoroethyleneresin molding powder obtained by a suspension polymerization to preparea polytetrafluoroethylene preform, sintering the preform at atemperature not lower than the melting point of the unsinteredpolytetrafluoroethylene, processing the sintered preform into films,then heating at least two of the obtained polytetrafluoroethylene filmsat a temperature lower than the melting point of the sinteredpolytetrafluoroethylene to contact bond them, further heating thepolytetrafluoroethylene film bonded product at a temperature not lowerthan the melting point of the sintered polytetrafluoroethylene to fuseand unite it, and subjecting the fused and united film to uniaxial orbiaxial stretching at a temperature not higher than the melting point ofthe sintered polytetrafluoroethylene resin.
 4. A process for preparing apolytetrafluoroethylene porous film comprising the steps ofcompression-molding a polytetrafluoroethylene resin molding powderobtained by a suspension polymerization to prepare apolytetrafluoroethylene preform, sintering the preform at a temperaturenot lower than the melting point of the unsinteredpolytetrafluoroethylene, processing the sintered preform into films,then heating at least two of the obtained polytetrafluoroethylene filmsat a temperature lower than the melting point of the sinteredpolytetrafluoroethylene to contact bond them, further heating thepolytetrafluoroethylene film bonded product at a temperature not lowerthan the melting point of the sintered polytetrafluoroethylene to fuseand unite it, subjecting the fused and united film to uniaxial orbiaxial stretching at a temperature not higher than the melting point ofthe sintered polytetrafluoroethylene resin, and then subjecting the filmto heat setting.
 5. The process for preparing a polytetrafluoroethyleneporous film as claimed in claim 3 or claim 4, wherein the heatingtemperature for preparing the polytetrafluoroethylene film bondedproduct by heating and contact bonding at least two of thepolytetrafluoroethylene films is within the range of 100° to 300° C. 6.The process for preparing a polytetrafluoroethylene porous film asclaimed in any of claims 1 to 4, wherein the stretching temperature forstretching the fused and united polytetrafluoroethylene film is withinthe range of 19° to 320° C.